Key Features:

Suitable for Desktops

Module Type: 240Pin Unbuffered DIMM Non ECC

DRAM Density: 128x8

Capacity: 6GB Kit (3x2GB)

Data transfer bandwidth: 10,664MB/Sec (PC3 10660)

CL-value: 7-7-7-21-2T

Working voltage: 1.5V~1.6V

PCB: 8-layer PCB

Extra features: Aluminum heat-sink

Warranty: Lifetime warranty

More Information Along with the debut of the P35, P45, X38, and X48 platforms, DDR3 technology has officially marched into the DDR3 1333 era, and thus securing DDR3 1333 specifications for the mainstream market. . Team Group Inc. will further introduce the Xtreem DDR3 1333 with lowered latency timings for overclockers, and offer the high performance with low latency on the X58 platform. To achieve the quality target, Xtreem DDR3 1333 relies on the vertical market by Team Group Inc., where each stage starting from the selection of chips, platform verification, and finally to product testing will be rigorously taken care of. Furthermore, the memory module is covered by the uniquely X-shaped heat spreader and bonded with high conducting thermal grease; offering stability even under increased operating temperatures. The improved data rate to DDR3 1333 offers 10.6GB/Sec of bandwidth, and becomes an impressive 30GB/Sec available bandwidth under the triple memory architecture. On the other hand, the Xtreem DDR3 1333 is aimed at latency timing performance, reaching 7-7-7-21 for the tCL, tRCD, tRP, and tRAS parameters. This not only offers performance greater than that of generic DDR3 1333 memory modules, but is also fast behind the heels of DDR3 1600.